RF/DC Magnetron Co-Sputtering
RF (Radio Frequency) and DC (Direct Current) magnetron sputtering systems are both methods of thin film deposition using a plasma to eject material from a target onto a substrate. RF sputtering is typically used for insulating materials, while DC sputtering is suitable for conducting materials. Both methods use a magnetron to enhance plasma density and sputtering rate.
MAKE : PLASSYS, FRANCE
MODEL NUMBER : MP 300
Technical Specifications:
| Source | : | Two RF and One DC gun (co-sputtering) |
| Electrical Power | : | DC (1KW) and RF (600 W) |
| Frequency of Operation | : | 13.56 MHz |
| Operating Pressure | : | 0.5 - 50 mTorr |
| Substrate Temperature | : | RT - 600°C |
| Substrate rotation | : | 30 RPM |
| Vacuum Pumps | : | Rotary and Turbo Molecular Pumps |
| Coating Materials | : | Conductors, Semiconductors and Insulators |
| Coating Area (Max) | : | 5x5 cm |
Consultancy Charge Details:
| Type | Internal(Student & Staff) (Rs.) | External Educational Institution / R&D) (Rs.) | Industry(Rs.) |
| Charges per deposition/coating | 1500 | 2000 | 3000 |
| Deposition at High Temperature | 2000 | 3000 | 5000 |
Staff-Incharge:
Dr. Shyju T S, Associate Professor (Research)
Dr. D. Dinesh Kumar, Associate Professor (Research)
Contact Details:
| Email ID | : | shyju@sathyabama.ac.in / ddkumar86@gmail.com |
| Phone No. | : | Dr. Shyju T S (+91- 9941655429) Dr. D. Dinesh Kumar (+91- 9976563823) |